METHOD OF RECYCLING USED SEMICONDUCTOR OR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a technique for recycling a used semiconductor wafer or substrate with less loss of the used semiconductor wafer. SOLUTION: The method of recycling the used semiconductor or substrate includes (a) a step of roughly grinding the used semiconductor wafer 1 having a function layer on a surface to remove the function layer; (b) a step of forming a protective layer 2 which can be removed by etching on the surface of the roughly ground semiconductor wafer 1; (c) a step of subjecting the semiconductor wafer 1 having the protective film 2 formed to dry etching and removing the protective layer 2 and a portion of the surface of the wafer 1 which is not covered with the protective layer 2 and exposed; and (d) a step of measuring flatness of the semiconductor wafer having been subjected to the dry etching, wherein if desired flatness is not obtained in the step (d), the steps of (b) to (d) are repeated until the desired flatness is obtained. COPYRIGHT: (C)2009,JPO&INPIT