| 摘要 |
<p>Provided is a substrate which is provided with an input/output terminal pin for mounting an electronic component such as a semiconductor package on a wiring board and has improved bonding reliability between the electronic component and the substrate provided with the pin. The substrate has the pin which has a flange-like pinhead section disposed on a shaft section and on the leading end of the shaft section and has a diameter larger than that of the shaft section. The substrate also has a wiring board having a pin pad exposed from the surface. The pinhead section and the pin pad are bonded with an adhesive material, an annular notch is formed on the surface of the pinhead section facing the shaft section, an inner circumference side end section of the annular notch is brought into contact with the facing surface, the inner circumference side end section of the annular notch and the shaft section are separated from each other, and the surface of the annular notch is on the side of the pin pad with respect to a surface which connects the inner circumference side end section and an outer circumference side end section with each other.</p> |
