COMPOSITE SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND SPACER SHEET USED IN THE SAME, AND METHOD FOR MANUFACTURING COMPOSITE SEMICONDUCTOR DEVICE

摘要

Disclosed is a composite semiconductor device which is formed by stacking a plurality of semiconductor packages. This composite semiconductor device comprises a spacer sheet inserted and adhered between a wiring connection substrate for an upper semiconductor package and a wiring connection substrate for a lower semiconductor package. Also disclosed are a method for manufacturing such a composite semiconductor device, and a method for connecting wirings by using such a spacer sheet. Consequently, there can be obtained a POP type composite semiconductor device with high packaging density.