| 摘要 |
PROBLEM TO BE SOLVED: To provide an aqueous dispersant for chemical mechanical polishing, for evenly and stably polishing a copper film with a low friction while providing both high polishing speed and high flattening characteristics, without causing defects on the copper film and an insulating film. SOLUTION: The aqueous dispersant for chemical mechanical polishing contains (A) a polymer containing a repeating unit represented by a formula (1), (B) at least two kinds of amino acid, (C) oxidant, and (D) abrasive grain. In the formula (1), Ar represents an aromatic ring. R represents one selected from among 1-10C substituted or unsubstituted hydrocarbon group, 1-10C substituted or unsubstituted alkoxyl group, substituted or unsubstituted phenoxy group, hydroxyl group, nitro group, amino group, and -SO<SB>3</SB>M group (M represents a monovalent cation). Y represents a single bond or 1-10C substituted or unsubstituted divalent hydrocarbon. n represents integer 0-5. COPYRIGHT: (C)2009,JPO&INPIT |
