| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit device that prevents unexpected trouble from occurring as stress is applied to a surface-mounted element bonded directly to a lead frame. SOLUTION: The circuit device includes the surface-mounted element 30 having two terminals 31 and 32, lead frames 10 and 20 having the terminals 31 and 32 of the surface-mounted element 30 bonded directly to terminal bonding portions 10a and 20a, and a sealing material 60 which seals the surface-mounted element 30 and lead frames 10 and 20. The lead frames 10 and 20 have a support portion 40 to be clamped and supported when sealed with the sealing material 60 and stress relaxation portions 11 and 12 which are easier to deform than a part adjacent to a region electrically in series with the surface-mounted element 30. COPYRIGHT: (C)2009,JPO&INPIT |
