| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board which can stably be produced without generating the failure of the connection of a through-hole conductor and an interconnect. <P>SOLUTION: The circuit board comprises: a planar base material 14 composed of a porous alumina substrate with a plurality of through-holes 15c; columnar through-hole conductors 16 formed inside the respective through-holes; insulating layers 18a and 18b provided on one main surface of the base material and the other main surface thereof, respectively; and the interconnects 12a and 12b provided so as to at least partially face each other. Then, the interconnects are conducted and connected to each other by the at least plurality of through-hole conductors. Thus, even when the density of the interconnects is increased, the stable production is performed without generating the failure of the connection of through-hole conductor. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
