| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a multilayer circuit board which aligns an upper layer with a lower layer without requiring transparency of a material for forming a layer. SOLUTION: In a method for producing a multilayer circuit board, a product substrate 10 having an alignment mark 14 on the surface, and a substrate 100 only for alignment having an alignment mark which is in mirror image relation with the alignment mark 14 on the surface are prepared, an alignment mark of the substrate only for product is imaged by means of a first camera K1, an alignment mark of the substrate only for alignment is imaged by means of a second camera K2, and based on a composite image of an alignment mark image of a substrate for product and an alignment mark image of a substrate only for alignment, the substrate for product and the substrate only for alignment are aligned and stuck back to back, and in a process for forming a multilayer wiring structure, a lower layer pattern formed already is aligned with an upper layer pattern to be formed anew thereon by using the alignment mark of the substrate only for alignment. COPYRIGHT: (C)2009,JPO&INPIT |
