| 摘要 |
PROBLEM TO BE SOLVED: To provide a metallized substrate having a small warpage and a high bonding strength of a high melting point metal layer in the metallized substrate having the high melting point metal layer on an aluminum nitride sintered compact substrate, and a method of manufacturing the metallized substrate. SOLUTION: In the metallized substrate having the high melting point metal layer on an aluminum nitride sintered compact substrate, an alumina sintered compact layer exists between the aluminum nitride sintered compact and the high melting point metal layer, and the high melting metal layer contains alumina. The method of manufacturing the metallized substrate comprises laminating an alumina paste layer and a high melting point metal paste layer containing alumina on the aluminum nitride sinterd compact substrate, and calcinating. COPYRIGHT: (C)2009,JPO&INPIT
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