WAFER BEVEL MACHINING METHOD, AND WHEEL TYPE ROTARY GRINDING WHEEL

摘要

PROBLEM TO BE SOLVED: To provide a bevel machining method for avoiding the life of a wheel type rotary grinding wheel from being easily shortened even when applying bevel machining to a wafer formed of a hard-to-machine material such as sapphire. SOLUTION: In the wafer bevel machining method, the wheel type rotary grinding wheel 20 having an annular grinding groove 10 approximately U-shaped in cross section is rotated at a high speed to give low-speed rotation to the wafer while making the outer peripheral face of the wafer 30 in contact with the annular grinding groove, when machining a water outer peripheral portion 31 and an edge portion 32. The annular grinding groove of the wheel type rotary grinding wheel consists of an annular flat bottom face portion 22 and an annular vertically inclined portion 21 extending outward from the bottom face portion. The width of the flat bottom face portion is set to be twice or more the thickness of the wafer. A region on the upper side of the flat bottom face portion in the cross direction and a region on the lower side thereof are individually used without overlapping each other, to machine the wafer outer peripheral portion. COPYRIGHT: (C)2009,JPO&INPIT