| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching processing method and a device therefor for protecting one side of a wafer and etching or rinsing the other side of the wafer. SOLUTION: In order to protect the wafer device surface of a substrate, the bottom of a pure water saucer is worked into a circular cone shape so that the surface tension due to pure water is uniformly applied throughout the interface part of the substrate while protecting the interface part by the pure water, and the circular cone-shaped end face is made the inside of a circumference of the substrate and a narrow space is formed between the substrate and a flat on the outside of the circumference of the substrate, and a plurality of substrates fixed by chucks in opposition to each other and the circular cone-shaped saucer of pure the water for substrate protection are coaxially rotated at the set number of revolutions, and surface tension of pure water and the centrifugal speed by rotation are balanced to prevent a rear side etching liquid or rinsing water from infiltrating to lower faces, whereby contamination of wafer device surface being the lower faces is prevented. When these substrates are dried, the pure water is replaced with clean nitrogen gas and the substrates are rotated until both sides of the substrates are dried. COPYRIGHT: (C)2009,JPO&INPIT
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