| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is suitable, especially, for reduction in pitch between lead wiring layers of a connector portion where migration prevention is necessary, and to provide a manufacturing method thereof. SOLUTION: The wiring board comprises: an insulating substrate 1 where a connector terminal portion having insert end edges 1a and 1A crossing a direction of connector insertion into an external connector is constituted; streaks of first and second lead wiring layers 21 to 24, and 31 to 33, which are formed in an array pattern parallel to the insertion direction on a surface of the insulating substrate of the connector terminal portion and contain silver components; first and second electrode terminal layers 21a to 24a, and 31a to 33a which are made to cover top surfaces and side edges of respective tip portions on insertion end edge sides, respectively; and an insulator protective layer 10 for migration prevention which are made to cover top surfaces and side edges of the respective lead wiring layers other than the respective tip portions. The first and second electrode terminal layers form an arrangement pattern having far/near relations with the insertion end edges. COPYRIGHT: (C)2009,JPO&INPIT
|
