发明名称 PREPARING METHOD AND EQUIPMENT OF SEMICONDUCTOR CRYSTAL THIN FILM
摘要 PROBLEM TO BE SOLVED: To remove a thermal absorption layer by a simple method without any smearing and furthermore to efficiently reduce defects of crystals, while carrying out a heating crystallization of an amorphous silicon thin film by using the thermal absorption layer. SOLUTION: The method of preparing a semiconductor crystal thin film comprises the steps of: previously providing a thermal absorption layer 3 in only a front surface of a place to which an amorphous semiconductor thin film is intended to be crystallized when the amorphous semiconductor thin film (a-silicon film 1) formed on a substrate 2 is crystallized; crystallizing the amorphous semiconductor thin film by carrying out an energy irradiation; thereafter adding modify substances (hydrogen or the like) by a dry process; and simultaneously performing a defect reduction of the crystallized semiconductor thin film (p-silicon film 1a), while embrittling the thermal absorption layer 3 and removing the thermal absorption layer 3 from the semiconductor thin film. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009147126(A) 申请公布日期 2009.07.02
申请号 JP20070323183 申请日期 2007.12.14
申请人 JAPAN STEEL WORKS LTD:THE 发明人 TAKAHASHI MASASHI;EBISAWA TAKASHI
分类号 H01L21/20 主分类号 H01L21/20
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