| 摘要 |
An electrically-conductive pin is inserted into a through hole penetrating through a substrate between a first surface and a second surface defined at the reverse side of the first surface so that the electrically-conductive pin stands upright from the first surface of the substrate. An electronic component is then mounted on the tip end of the electrically-conductive pin standing upright from the first surface. The electrically-conductive pin is inserted into the through hole before an electronic component is mounted on the tip end of the electrically-conductive pin. It is thus extremely easy to insert the electrically-conductive pin into the through hole. As compared with the case where the electrically-conductive pins are first bonded to an electronic component, an operator is released from a troublesome operation of inserting the electrically-conductive pin. The electronic component can be mounted in an efficient manner.
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