| 摘要 |
<p>An alignment system for lithography and a manufacturing method of a semiconductor device using the same are provided to rapidly and accurately perform an alignment process by using an alignment mark part of uniform distribution as an alignment coordinate. An alignment system for lithography performs an alignment process of a wafer by using a diffracted light reflected after a laser wavelength is irradiated on an alignment mark formed on the wafer, and includes a light generating device, a test device(160), and an alignment device(180). The light generating part(100) generates an alignment light of a different wavelength. A light-blocking part(120) selectively passes the alignment light of the different wavelength. A first splitter(130) distributes the alignment light passing the light-blocking part. A beam shaping part(140) determines a beam shape of the alignment light passing through the first splitter. A second splitter(150) distributes the alignment light irradiated from the beam shaping part to the test device or the alignment device. A beam guide part(170) provides a path for irradiating the alignment light passing through the second splitter on the wafer.</p> |
