| 摘要 |
An electrostatic chuck of a semiconductor wafer and a method for fixing a wafer using the same are provided to prevent a wafer sticking phenomenon by fixing a wafer during up/down operations of a lift. An electrostatic chuck of a semiconductor wafer comprises an electrostatic chuck, a lift pin, and a lift driving part. The electrostatic chuck(120) loads a wafer(110). The lift pin(130) passes through the electrostatic chuck, and lifts the wafer. The lift driving part(140) is installed in a bottom part of the electrostatic chuck, and fixes the wafer through vacuum when moving the lift pin by selectively making an inner part of the lift pin into a low vacuum state or a low voltage state. When the lift pin descends in order to load the wafer on the electrostatic chuck, the wafer is fixed by maintaining a low vacuum state. When the lift pin ascends in order to unload the wafer from the electrostatic chuck, a pumping is performed in the lift driving part. The wafer is fixed through the vacuum by making an inner part of the lift pin into a low pressure condition.
|
