| 摘要 |
PROBLEM TO BE SOLVED: To smoothly vertically move a shutter through a plurality of shafts sliding in a guide hole, even when longitudinal thermal deformation is produced in the shutter. SOLUTION: This vacuum heating device 10 for a wafer supplies moving force for vertical movement to the shutter 3 from a drive mechanism 7 via the shafts 4 and 5. The shaft 5 is divided into two portions, such as, an upper first member 51 and a lower second member 52, and an engaging groove 521 for sliding an engaging piece 513 formed on the upper first member 51 in the longitudinal direction (the direction of the arrow X) of the shutter 3 is formed on the lower second member. The upper end of the shaft 4 and the first member 51 are fixed to the shutter 3. When thermal expansion is produced in the direction of in the arrow X in the shutter 3, the first member 51 is displaced in the direction of the arrow X, with respect to the second member 52, and deformation will not be produced in the shaft 4 and the second member 52. COPYRIGHT: (C)2009,JPO&INPIT |
