发明名称 ADHESIVE FOR CIRCUIT MEMBER CONNECTION, CIRCUIT BOARD, AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an adhesive for circuit member connection, which is free from the increase of connection resistance and exfoliation of a connecting agent at a connection part and considerably improves connection reliability, a circuit board having circuit members connected to each other, and the manufacturing method thereof. SOLUTION: The adhesive 40 for circuit member connection is interposed between circuit electrodes facing each other to electrically connect electrodes in a pressurizing direction by direct contact by applying a pressure to the circuit electrodes facing each other and contains an adhesive resin composition and an insulating inorganic filler and the circuit member connecting adhesives 40 containing 10 to 200 pts.wt. of the insulating inorganic filler with respect to 100 pts.wt. of the adhesive resin composition, and the adhesive 40 is used to connect circuit members to each other. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009147361(A) 申请公布日期 2009.07.02
申请号 JP20090032626 申请日期 2009.02.16
申请人 HITACHI CHEM CO LTD 发明人 WATANABE ITSUO;TAKEMURA KENZO;NAGAI AKIRA;ISAKA KAZUHIRO;WATANABE OSAMU;KOJIMA KAZUYOSHI
分类号 H01L21/60;C09J5/00;C09J7/00;C09J11/04;C09J11/06;C09J133/00;C09J133/14;C09J163/00;C09J201/00 主分类号 H01L21/60
代理机构 代理人
主权项
地址