| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device whose body can be made compact while securing heat dissipation of the semiconductor having a plurality of heating elements provided on a metal base. <P>SOLUTION: In an inverter device 11, the metal base 13 mounted with a plurality of semiconductor chips 24 is fixed to a heat sink 12 by fastening screws 15 and heat generated by the semiconductor chips 24 is conducted to the heat sink 12 via the metal base 13. The metal base 13 is formed in a nearly rectangular shape, and fixed to the heat sink 12, by fastening the screws 15, in a state where a frame 20 formed of a sidewall 18 that extends along a part excluding parts of a peripheral edge of the metal base 13 into which the screws 15 are inserted abuts against the metal base 13, via a cover 14 having the frame 20. A material having higher rigidity and heat conductivity than aluminum-based metal is used for the cover 14. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
