发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 A semiconductor device includes: a semiconductor substrate; a diode having a cathode formed on a first surface side of the semiconductor substrate and an anode formed on a second surface side of the semiconductor substrate; and a transistor formed over the semiconductor substrate. The transistor includes a semiconductor layer laminate formed over the semiconductor substrate, a source electrode and a drain electrode that are formed spaced apart from each other over the semiconductor layer laminate, and a gate electrode formed between the source electrode and the drain electrode. The source electrode is electrically connected to the anode, and the drain electrode is electrically connected to the cathode.
申请公布号 US2009166677(A1) 申请公布日期 2009.07.02
申请号 US20080329939 申请日期 2008.12.08
申请人 SHIBATA DAISUKE;MORITA TATSUO;YANAGIHARA MANABU;UEMOTO YASUHIRO 发明人 SHIBATA DAISUKE;MORITA TATSUO;YANAGIHARA MANABU;UEMOTO YASUHIRO
分类号 H01L21/338;H01L29/812 主分类号 H01L21/338
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