发明名称 |
CHEMICAL-MECHANICAL PLANARIZATION PAD |
摘要 |
The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.
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申请公布号 |
US2009170413(A1) |
申请公布日期 |
2009.07.02 |
申请号 |
US20080347788 |
申请日期 |
2008.12.31 |
申请人 |
INNOPAD, INC. |
发明人 |
HSU OSCAR K.;LEFEVRE PAUL;JIN MARC C.;ALDEBORGH JOHN ERIK;WELLS DAVID ADAM |
分类号 |
B24D11/00;B24B41/00;B24D18/00 |
主分类号 |
B24D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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