COPPER FOIL FOR PRINTED WIRING BOARD

摘要

Provided is a copper foil which is to be used for a printed wiring board, has both excellent adhesiveness to an insulating board and excellent etching characteristics and suitable for fine pitches. The copper foil is provided with a copper foil base material and a coat layer which covers at least a part of the surface of the copper foil base material. In the copper foil, (1) the coat layer is composed of a Ni layer and a Cr layer which are sequentially laminated from a surface of the copper foil base material, (2) a Cr of 15-210µg/dm2 and a Ni of 15-440µg/dm2 exist in the coat layer, and (3) the maximum thickness is 0.5-5nm and the minimum thickness is 80% or more of the maximum thickness when a cross-section of the coat layer is observed by a transmission electron microscope.