发明名称 |
METHOD OF MANUFACTURING FLEXIBLE PRINTED-WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible printed-wiring board capable of improving a yield by effectively preventing the occurrence of burrs on a shear plane when punching is conducted to a laminate stacking a conductor on a base material, particularly the laminate stacking a reinforcing plate while preventing the deterioration of the productivity of the flexible printed-wiring board. SOLUTION: The conductor 4 forming a connecting terminal section 8 and the laminate 1a stacking the reinforcing plate 13 are manufactured on the base material 2. Slits 30 are formed to the shearing sections 18 of the laminate 1a. The reinforcing plate 13 is shorn by integrally punching the laminate 1a in the shearing sections 18. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009147224(A) |
申请公布日期 |
2009.07.02 |
申请号 |
JP20070325018 |
申请日期 |
2007.12.17 |
申请人 |
SUMITOMO ELECTRIC PRINTED CIRCUIT INC |
发明人 |
SHINODA TAKAAKI;CHATANI MASAICHI;SATO FUTOSHI |
分类号 |
H05K3/00;H05K1/02 |
主分类号 |
H05K3/00 |
代理机构 |
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