发明名称 METHOD OF MANUFACTURING FLEXIBLE PRINTED-WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexible printed-wiring board capable of improving a yield by effectively preventing the occurrence of burrs on a shear plane when punching is conducted to a laminate stacking a conductor on a base material, particularly the laminate stacking a reinforcing plate while preventing the deterioration of the productivity of the flexible printed-wiring board. SOLUTION: The conductor 4 forming a connecting terminal section 8 and the laminate 1a stacking the reinforcing plate 13 are manufactured on the base material 2. Slits 30 are formed to the shearing sections 18 of the laminate 1a. The reinforcing plate 13 is shorn by integrally punching the laminate 1a in the shearing sections 18. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009147224(A) 申请公布日期 2009.07.02
申请号 JP20070325018 申请日期 2007.12.17
申请人 SUMITOMO ELECTRIC PRINTED CIRCUIT INC 发明人 SHINODA TAKAAKI;CHATANI MASAICHI;SATO FUTOSHI
分类号 H05K3/00;H05K1/02 主分类号 H05K3/00
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