| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of forming laser machining grooves on the rear surface of a wafer along streets without damaging the surface of the wafer by irradiating the rear surface of the wafer with a laser beam along predetermined streets. <P>SOLUTION: The laser beam machining apparatus includes a chuck table for holding a wafer and with a laser beam irradiation means for irradiating the wafer, which is held by the chuck table, with a laser beam. The laser beam irradiation means includes a laser beam oscillating means for oscillating a laser beam and with a condenser having a condensing lens for condensing a laser beam oscillated from the laser beam oscillating means. The condensing lens condenses the laser beam, which is oscillated from the laser beam oscillating means, at a condensing point in a state of steep distribution, and disperses the laser beam passing through the condensing point in a state of uniform distribution of space intensity. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
