| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition with which an adhesive layer excellent in adhesivity with metal surface and adhesion durability can be formed; a cover lay which is obtained by using the same and is excellent in adhesivity with the metal layer of a substrate wiring or the like, a reinforcing film, a flexible copper-clad laminated sheet and a flexible printed wiring board. SOLUTION: The adhesive composition contains respective components represented by following (A) to (C). (A): A curable compound having a function forming an interaction with a metal. (B): At least one selected from a phenoxy resin or an elastomer. (C): A curing agent. The adhesive film, the cover-lay, the reinforcing film, the flexible copper-clad laminated sheet, and the flexible printed wiring board are obtained by using the adhesive composition. COPYRIGHT: (C)2009,JPO&INPIT
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