发明名称 |
Methods and Apparatus for Forming a Slurry Polishing Pad |
摘要 |
Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.
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申请公布号 |
US2009170416(A1) |
申请公布日期 |
2009.07.02 |
申请号 |
US20070967818 |
申请日期 |
2007.12.31 |
申请人 |
CADY RAYMOND CHARLES;MOORE MICHAEL JOHN;SHALKEY MARK ALEX;STOCKER MARK ANDREW |
发明人 |
CADY RAYMOND CHARLES;MOORE MICHAEL JOHN;SHALKEY MARK ALEX;STOCKER MARK ANDREW |
分类号 |
B24B7/00;B23P19/04 |
主分类号 |
B24B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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