| 摘要 |
A bar is cut from a wafer having head elements arrayed thereon along sectional surfaces parallel to each other and orthogonal to a wafer surface. One sectional surface is set as a medium opposing surface of a head slider. Polishing processing is performed on the bar, starting from a "surface corresponding to rear side" corresponding to a wafer rear surface, with a grinding surface rubbed in a transverse direction of the bar. The roughness of the "surface corresponding to rear side" of the bar is reduced. By suppressing the surface roughness in this way, a read element and write element among head elements can be obtained with high dimensional accuracy. Such a manufacturing method considerably contributes to reduction of a dimension error of a head element, in particular, a write element.
|
