发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED LAYER, PROTECTING LAYER, INSULATING LAYER AND SEMICONDUCTOR DEVICE AND DISPLAY THEREWITH |
摘要 |
A positive-type photosensitive resin composition that exhibits excellent adhesion to a substrate after a humidification treatment includes (A) an alkali-soluble resin, (B) a photosensitive diazoquinone compound, and (C-1) a silicon compound shown by the following formula (1), wherein R1 and R2 represent alkyl groups having 1 to 10 carbon atoms, R3 represents an organic group, and R4 represents an alkylene group having 1 to 10 carbon atoms, and i represents an integer from 0 to 2.
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申请公布号 |
US2009170026(A1) |
申请公布日期 |
2009.07.02 |
申请号 |
US20080343983 |
申请日期 |
2008.12.24 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
SUGIYAMA HIROMICHI;BANBA TOSHIO;OKAMYO SHUSAKU |
分类号 |
G03F7/004 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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