| 摘要 |
A heat dissipation substrate and a light emitting diode package including the same are provided to improve thermal conductivity by forming a ceramic thin film on a top part of a heat dissipation plate through an aerosol deposition method. A heat dissipation substrate comprises a heat dissipation plate(100), a ceramic thin film, and a circuit pattern. The ceramic thin film(110) is formed on a top part of the heat dissipation plate. The circuit pattern(120) is formed on a top part of the ceramic thin film. The heat dissipation plate is made of one material selected among Al, Cu, Mo, W, Ti, and Mg. The ceramic thin film is formed by an aerosol deposition method. The ceramic thin film is made of one material selected among Al2O3, AlN, BeO, and Y2O3 or composition thereof. |
