ADHESIVE COMPOSITION AND ADHESIVE TAPE USING THE SAME

摘要

An adhesive composition is provided to avoid damages of a chip due to excellent adhesion with a substrate before photocuring, and to lower strippability and increase pick-up property after photocuring. An adhesive composition comprises a photocurable acrylic copolymer containing an epoxy ring, a thermosetting copolymer containing a carboxyl group, a photoinitiator and a thermosetting material. The composition includes a thermosetting copolymer containing a carboxyl group of 1-10 parts by weight based on the solid portion of the whole binder resin. The photocurable acrylic copolymer containing an epoxy ring and the thermosetting copolymer containing a carboxyl group are hardened by the same thermosetting material.