发明名称 THERMOSETTING RESIN COMPOSITION AND CURED FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a cured film which particularly excels in planarity and heat resistance and also excels in chemical resistance such as solvent resistance, acid resistance and alkali resistance, water resistance, adhesion to a substrate such as glass, transparency, mar resistance, coating properties, and light resistance, and a resin composition which gives this cured film. <P>SOLUTION: The thermosetting resin composition comprises a polymer having a specific constituting unit, an epoxy resin, an epoxy resin curing agent, and preferably further a solvent. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009144025(A) 申请公布日期 2009.07.02
申请号 JP20070321549 申请日期 2007.12.13
申请人 CHISSO CORP 发明人 EGASHIRA TOMOHIRO;WATANABE EIJI;ITAMI SETSUO;SATO HIROYUKI
分类号 C08G59/46;C08F8/14;G02B5/20;G02F1/1335 主分类号 C08G59/46
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