发明名称 CHIP COMPONENT MOUNTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a chip component mounting device capable of easily varying the mounting load of a chip component on a substrate and selectively changing a plurality of suction nozzles. <P>SOLUTION: A load varying mechanism 30 includes: a voice coil motor 31 capable of adjusting the value of a thrust by adjusting the value of a driving current; and a spline shaft (rotary shaft) 33 being the output shaft of the voice coil motor 31 which penetrates the center of a rotor 32 to move vertically and also rotate. A selecting mechanism 35 includes: a pulse motor 36 which is a rotary motor provided below the voice motor 31 integrally with the voice coil motor 31 and where a lower portion of the spline shaft 33 penetrates the center thereof; and a switching body 41. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009147132(A) 申请公布日期 2009.07.02
申请号 JP20070323257 申请日期 2007.12.14
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 KOMATSU RYUICHI;HINENO KAZUHIRO;ICHIKAWA YOSHIO
分类号 H05K13/04 主分类号 H05K13/04
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