| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component module which increases the number of mounted electronic components and miniaturize size and provide an electronic component module which facilitates optical data communication with other electronic component modules on which an optical semiconductor element is mounted. <P>SOLUTION: An electronic component 4 comprising an optical semiconductor element 5 comprising a light emitting element 5a and a light receiving element 5b is mounted on at least one of both principal surfaces of a substrate 2 of an electronic component module 1 and at least one or more of end surfaces of the substrate. The electronic component module 1 has a concave portion on at least one of the end surfaces and the principal surfaces. The electronic component 4 comprising the optical semiconductor element 5 is also mounted on the concave portion. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
