| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce costs by improving handling properties and increasing a yield in the printed board manufacturing process with regard to a copper foil with a carrier in the production of one side used in a printed wiring board or a multilayer laminate, especially concerning a copper foil with a carrier used in the production of a laminate. <P>SOLUTION: This metal foil with a carrier is a laminate in which the carriers A and the metal foils B are laid alternately to overlap each other, the carrier A and the metal foil B have respective glossy surfaces (S surface), and the glossy surfaces are laminated to face each other. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
