| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method where a through-hole and a blind via with a uniform size and a high aspect ratio are drilled at a depth exceeding the focal depth of a condensing laser beam in such a manner that the sticking of debris to the face to be machined is prevented. <P>SOLUTION: In the laser drilling method where a condensing laser beam 10 from a single pulse laser in a uniform horizontal mode capable of drilling to a workpiece is made incident on the workpiece 1, so as to drill the same, at least the incidence side of the condensing laser beam 10 in the workpiece 1 is covered with a cover member 11, and then, the condensing laser beam 10 is made incident thereon, thus the workpiece 1 is drilled together with the cover member 11, and after the drilling, the cover member 11 is separated from the workpiece 1. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
