发明名称 |
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A wiring board is provided. The wiring board includes: a core substrate; wiring layers formed on the core substrate; and a reinforcement conductor which penetrates through the core substrate and which is formed by flat-plate-shaped conductor portions that intersect each other in a plan view. The reinforcement conductor is formed by intersecting vertical crosspieces and horizontal crosspieces and assumes a lattice form in the plan view.
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申请公布号 |
US2009166077(A1) |
申请公布日期 |
2009.07.02 |
申请号 |
US20080335907 |
申请日期 |
2008.12.16 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
HIRAKAWA EIICHI |
分类号 |
H05K1/00;C25D5/02;H05K1/11;H05K3/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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