| 摘要 |
A BGA package module desoldering apparatus for detaching a chip module from a circuit board is disclosed to include a heat source for heating the chip module, and radiators each having a tank and a refrigerant received in the tank for attaching to the circuit devices of the circuit board around the chip module to be detached to shield the circuit devices against the heat energy from the heat source and to lower the temperature of the circuit devices during heating of the chip module by the heat source.
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