发明名称 FILMING TREATMENT JIG, PLASMA CVD APPARATUS, AND METAL PLATE AND OSMIUM FILM FORMING METHOD
摘要 Provided is a filming treatment jig for forming a thin film on a plate having a through hole of a micro diameter by a single plasma filming treatment. The filming treatment jig (8) comprises a holding member (39) for clamping an aperture plate (107) having a through hole, to hold the same with the through hole and the front and back surfaces of the aperture plate being exposed, and an electrode member having the holding member mounted thereon. The filming treatment jig (8) is characterized in that the electrode member is electrically connected with an electrode, to which the plasma electric-power of a plasma CVD apparatus is applied.
申请公布号 WO2009081897(A1) 申请公布日期 2009.07.02
申请号 WO2008JP73288 申请日期 2008.12.22
申请人 DAIWA TECHNO SYSTEMS CO., LTD.;SHIRATO, TAKESHI;HONDA, YUUJI;SATO, HIROSHI;OSAWA, MASAMICHI 发明人 SHIRATO, TAKESHI;HONDA, YUUJI;SATO, HIROSHI;OSAWA, MASAMICHI
分类号 C23C16/458;C23C16/06;H01J9/14;H01J37/09;H05H1/46 主分类号 C23C16/458
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