| 摘要 |
A method of fabricating a semiconductor leadframe package from a strip including multiply encapsulated leadframe packages, and a leadframe package formed thereby are disclosed. An entire row or column of leadframes gets encapsulated together. Encapsulating an entire row or column reduces the keep-out area between adjacent leadframe packages, which allows the internal leads of each leadframe and the semiconductor die coupled thereto to be lengthened. |
