BARRIER FILMS CONTAINING MICROLAYER STRUCTURES

摘要

Films containing microlayer structures are provided. In a general embodiment, the present disclosure provides a film containing a first microlayer of a heat resistant polymer and a second microlayer of a barrier polymer having a heat distortion temperature ranging between about 50° C. and about 120° C. attached to the first microlayer. Each of the first microlayer and the second microlayer has a thickness ranging from about 0.01 microns to about 10 microns.