| 摘要 |
A film thickness measurement system of wafer in which the decontamination remover of the reference chip is equipped is provided to regularly maintain the thickness of the reference chip by periodically removing the water molecule evaporated on the reference chip. A hot plate(100) is integrated between the upper side of the reference block(12) and the lower side of the reference chip. A heater(200) is installed outside the reference block and supplies the heat to the hot plate and heats up the hot plate. The decontamination remover of reference chip comprises a temperature sensor(300), a central processing unit(400) and a controller(600). The temperature sensor is equipped on the upper side of the hot plate and senses the temperature of the hot plate. The central processing unit compares the temperature sensed by the temperature sensor with the temperature stored in database. The controller controls the heater based on the comparison result. |
