| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a joining method for joining two substrates strongly with close dimensional accuracy and efficiently under a low temperature, and to provide a joined body comprising a joining film joined by such a joining method. <P>SOLUTION: The joining method includes the steps of: providing a first substrate 21 and a second substrate 22 to be joined to each other via a joining film and holding these substrates in the state separated from each other via a spacer 25; allowing a liquid material 30 containing a silicone material to permeate into a space 26 between the substrates 21 and 22 by a capillary phenomenon; drying the liquid material 30; and imparting energy to the dried body of the liquid material 30 to obtain a joined body in which the substrates 21 and 22 are joined via the joining film. <P>COPYRIGHT: (C)2009,JPO&INPIT |
