发明名称 SEAL COMPOSITION, AND COMPOSITE POROUS BODY
摘要 <P>PROBLEM TO BE SOLVED: To provide a sealing composition (especially for making a conductive porous body to be a gas diffusion layer member) which has a sealability for sealing an end surface of the conductive porous body and moldability for molding integrally with the conductive porous body and moreover has suitable mechanical properties (hardness, strength, elongation or the like) and has an excellent chemical resistance (especially an acid resistance) and a thermal resistance. <P>SOLUTION: The sealing composition contains: an EPDM having a Mooney viscosity 40-100 (ML(1+4) 100&deg;C), an ethylene content 50-62 wt.%, and a dien content 2-10 wt.%; carbon black; and an organic peroxide. Preferably, the composition contains 10-120 parts weight of the carbon black and 0.5-5 parts weight of the organic peroxide per 100 parts weight of the EPDM and does not contain a plasticizer, a processing aid and a lubricant nor the like. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009146614(A) 申请公布日期 2009.07.02
申请号 JP20070320058 申请日期 2007.12.11
申请人 MITSUBISHI CABLE IND LTD;MITSUBISHI MATERIALS CORP 发明人 HAMAKUBO SHINJI;KOBIKI KAZUHIKO;WADA MASAHIRO;KANDA EIKO
分类号 H01M8/02;H01M4/86;H01M8/10 主分类号 H01M8/02
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