| 发明名称 |
CHIP PROTECTIVE FILM |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip protective film for preventing the occurrence of chipping when dicing a wafer, and for improving the transverse strength. SOLUTION: The chip protective film includes a curative protective film forming layer 2 in which pencil hardness after curing is≥5H. COPYRIGHT: (C)2009,JPO&INPIT |
| 申请公布号 |
JP2009147277(A) |
申请公布日期 |
2009.07.02 |
| 申请号 |
JP20070325974 |
申请日期 |
2007.12.18 |
| 申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
YAMAKAWA TAKANORI;MORISHIMA YASUMASA;ISHIWATARI SHINICHI |
| 分类号 |
H01L21/301;B32B27/38;C09D7/12;C09D109/02;C09D163/00;C09D177/00;C09D201/00;H01L21/683 |
主分类号 |
H01L21/301 |
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