发明名称 |
Method for Enhancing the Adhesion of a Passivation Layer on a Semiconductor Device |
摘要 |
In a method for making a semiconductor component, an integrated circuit is provided with a chip pad on an active side. A conductive track is connected to the chip pad and a passivation layer covers the conductive track. Forming the conductive track includes structuring an uneven sidewall for form closure with the passivation layer.
|
申请公布号 |
US2009166848(A1) |
申请公布日期 |
2009.07.02 |
申请号 |
US20070967165 |
申请日期 |
2007.12.29 |
申请人 |
BERGHOF VOLKER;SCHEDEL THORSTEN |
发明人 |
BERGHOF VOLKER;SCHEDEL THORSTEN |
分类号 |
H01L23/12;H01L21/44 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|