| 摘要 |
A semiconductor assembly is provided that includes a first substrate that has a first surface. A second substrate is coupled to and spaced apart from the first substrate. The second substrate has a second surface facing the first surface of the first substrate. The second substrate includes a set of cavities. A set of non-conductive pillars is disposed on and protrudes from the first surface of the first substrate. The set of non-conductive pillars is configured and positioned to engage the set of cavities of the second substrate to align the second substrate with the first substrate. |
