SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A method for manufacturing a semiconductor device is provided with a bonding step of bonding a first substrate having light transmitting characteristics and a second substrate having a functional element on one surface with each other so that the functional element faces the first substrate; a substrate thinning step of thinning at least the first substrate or the second substrate; and a through hole forming step of forming a cavity and a through hole connected to the cavity at least on a part of a bonding portion between the first substrate and the second substrate. The substrate can be uniformly reduced in thickness by eliminating generation of nonuniformity and cracks due to existence of the cavity after polishing. The semiconductor device, which can contribute to size reduction of a device and that of an electronic apparatus wherein the device is to be mounted, can be manufactured by the simpler steps.