发明名称 THERMALLY EXPANSIBLE FIREPROOF DEVICE AND FIREPROOF STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thermally expansible fireproof device capable of facilitating work for providing a fireproof structure on a floor for a fireproof compartment and of quickly closing the opening between a wire-pipe material and a fireproof device body; and the fireproof structure using the thermally expansible fireproof device. <P>SOLUTION: This thermally expansible fireproof device 11 is installed between a through-hole 34 formed on a floor W for the fireproof compartment and a wire-pipe material 33 inserted into the through-hole 34. This thermally expansible fireproof device 11 is provided with the fireproof device body 12 consisting of thermally expansible rubber having rubber elasticity retaining the shape, wherein the fireproof device body 12 is inserted into the through-hole 34, has a cylindrical shape and is provided with an insertion hole 20 where the wire-pipe material 33 is insertable. The fireproof device body 12 is provided with a large diameter portion 12a and a small diameter portion 12b formed with a propagation space S opened downward, in the through-hole 34 for propagating heat along the fireproof device body 12 from the lower side to the upper side. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009142487(A) 申请公布日期 2009.07.02
申请号 JP20070323574 申请日期 2007.12.14
申请人 MIRAI IND CO LTD 发明人 SUGIHARA NOBUKAZU;ISHII TAKAYUKI
分类号 A62C3/16;E04B1/94;H02G3/22 主分类号 A62C3/16
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