发明名称 CONDUCTIVE PASTE AND MULTILAYER WIRING BOARD USING IT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide conductive paste for realizing interlayer connection of high reliability without gas generation or swelling accompanying it. <P>SOLUTION: The conductive paste contains a conductive metal material and a resin material. The conductive metal material contains high-melting-point metal and low-melting-point metal, which latter contains Sn. The resin material contains thermoplastic polyester resin. A content of the Sn is 20% by mass to 30% by mass of the conductive metal material as a whole. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009146839(A) 申请公布日期 2009.07.02
申请号 JP20070325487 申请日期 2007.12.18
申请人 SONY CHEMICAL &amp, INFORMATION DEVICE CORP 发明人 OMORI YOSHIO;UMEZU NORIO
分类号 H01B1/22;H01B1/00;H05K1/11;H05K3/12;H05K3/46 主分类号 H01B1/22
代理机构 代理人
主权项
地址