发明名称 |
CONDUCTIVE PASTE AND MULTILAYER WIRING BOARD USING IT |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide conductive paste for realizing interlayer connection of high reliability without gas generation or swelling accompanying it. <P>SOLUTION: The conductive paste contains a conductive metal material and a resin material. The conductive metal material contains high-melting-point metal and low-melting-point metal, which latter contains Sn. The resin material contains thermoplastic polyester resin. A content of the Sn is 20% by mass to 30% by mass of the conductive metal material as a whole. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
申请公布号 |
JP2009146839(A) |
申请公布日期 |
2009.07.02 |
申请号 |
JP20070325487 |
申请日期 |
2007.12.18 |
申请人 |
SONY CHEMICAL &, INFORMATION DEVICE CORP |
发明人 |
OMORI YOSHIO;UMEZU NORIO |
分类号 |
H01B1/22;H01B1/00;H05K1/11;H05K3/12;H05K3/46 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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