| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a double-sided wiring board in which a metal layer is uniformly etched on both surfaces of the board. SOLUTION: An etching device 1 comprises a path 16 through which an oblong base material 20, comprising a first metal layer 22 and a second metal layer 23 formed on both surfaces of an insulating substrate 21, passes, and a first chemical liquid nozzle 9 and second chemical liquid nozzle 10 arranged to face each other, across a space, to sandwich the path 16 vertically. In a first half etching process S1, the oblong base material 20 is made to pass the path 16 of an etching part 3 in such manner as the first metal layer 22 faces the first chemical liquid nozzle 9 while the second metal layer 23 faces the second chemical nozzle 10. In a second half etching process S4, the oblong base material 20 is made to pass the path 16 of an etching part 3 while the metal second layer 23 faces the first chemical liquid nozzle 9 and the first metal layer 22 faces the second chemical liquid nozzle 10. COPYRIGHT: (C)2009,JPO&INPIT
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