| 摘要 |
PROBLEM TO BE SOLVED: To provide a photoelectric conversion device which can be made higher in productivity than before. SOLUTION: A wiring pattern 30 is formed on a surface on a side opposed to a VCSEL bare chip 10 between both surfaces of a glass plate 23, a VCSEL module 1 is formed by joining the wiring pattern 30 and an electrode of the VCSEL bare chip 10 together using solder, and an opening for receiving the bare chip of the VCSEL module 1 is formed in an electronic circuit board 90. A peripheral edge of the glass plate 23 is superposed on a circumferential place of the opening of the electronic circuit board 90, the wiring pattern of the electronic circuit board 90 in the superposition region and the wiring pattern 30 of the glass plate 23 are joined together using solder, and the surface on the side superposed on the peripheral edge of the glass plate 23 between both surfaces of the electronic circuit board 90 is made to abut against an unillustrated substrate holding member of the photoelectric conversion device, thereby positioning the VCSEL module 1 on the substrate holding member. COPYRIGHT: (C)2009,JPO&INPIT
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